Technology

Among Microdul’s strengths is the exceptional know-how in the areas of chip-on-chip, chip-on-board and chip-on-ceramic applications. Microdul masters the following process technologies and more: 

• Die and wire bonding
• Globtop coating
• Flip chip
• SMD mounting (Smallest components 008004)
• Vacuum soldering
• Hand soldering
• Adhesive joining
• Heat sealing
• Laser trimming (active/passive)
• Module potting
• Functional testing

The right substrate for each application
We process all common substrates, such as FR4, FR5, Rigid-Flex, Flex, IMS, Rogers, as well as thin-film, thick-film and DCB ceramics. This enables reliable applications in the fields of analogue, digital, high-voltage and high-frequency technology. Our own thick-film manufacturing facilities as well as contacts with established substrate manufacturers over many years allow us to react flexibly to the most challenging wishes of our customers.

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  Fully automated Au wire bonder

  Process: ball/wedge with 25um Au wire on a ceramic thick film substrate

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  Fully automated Al wire bonder

  Process: wedge/wedge with 25um Al wire in ceramic package

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  Fully automated die bonder

  Process: chip-on-chip (COC)

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  Fully automated flip-chip assembly with integrated dip station (flux)

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  Hand soldering of wire strands (under binocular loupe)

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  Fully automated die bonder

  Assembly on rigid PCB

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  Fully automated Al wire bonder

  Process: wedge/wedge with 25um Al wire

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  Fully automated Au wire bonder

  Process: ball/wedge with 25um Au wire