iMAPS NE 52nd Symposium & Expo
Crowne Plaza Boston – Woburn by IHG
MA-01801 Woburn, MA (USA)
The following of our experts advised you at the Microdul booth:
Microdul was the official Gold Sponsor of the event.
Jim Ohneck is on the technical committee for advanced packaging and was host at the panel discussion.
This event was co-located with IMAPS' Wire Bonding Workshop: Wire Bonding Workshop | IMAPS
Further information: International Microelectronics Assembly and Packaging Society